In thick film power resistor plan material determination is basic to guarantee the resistor can both disperse the necessary measure of warmth and hold a steady opposition after some time.
Significant issues to consider in thick film http://www.hv-caps.com/ resistor configuration include:
• Resistor resilience
• Temperature coefficient of obstruction
• Resistance float
• Power rating
Regularly the force rating and opposition float are the most significant however all are identified with the fitting selection of materials. For instance the force rating and temperature coefficient of opposition are to a great extent reliant upon the decision of substrate material. While opposition float is more identified with the resistor glue and handling.
No single substrate material is an optimal decision https://www.mic-mosfet.com/ which fulfills every one of the significant properties of thick film substrates. The decision of substrate material is along these lines frequently identified with the electrical, warm and mechanical requests of the application. An optimal thick film substrate ought to have:
• Low dielectric consistent
• Good dimensional soundness during preparing
• Good attachment among substrate and written words
• High warm conductivity
• A warm coefficient of development coordinating with different materials in the circuit
• High electrical resistivity
Alumina is a typical decision which fulfills most of the above http://www.rigobertoparedes.com/ prerequisites in many applications anyway it is weak and can snap (particularly with huge substrates), molding can likewise frequently be an issue. For extremely high force scattering Aluminum Nitride is regularly utilized as it has >5 times the warm conductivity of Alumina yet it is moderately costly and requires the utilization of extraordinary printing glues and handling.
With the substrate material set up the resistor material ought to be characterized. Resistor materials are applied in glue structure by screen printing and are then terminated by warming to a high temperature. Resistor glues have three principle fixings:
• The practical components (metal compound or oxide particles)
• Binder (glass particles)
• Organic solvents and impermanent folio
The impermanent folios give command over the printing interaction. They dissipate right off the bat in the terminating interaction along with the solvents. The glass particles soften in the terminating cycle, tie the dynamic particles together, stick to the substrate and give dependability to the circuit.